Cyntec, a leading provider of power and passive components, is responding to the growing demand for high power density and thermal efficiency in AI servers. To support this trend, especially in High Voltage Direct Current (HVDC) power architectures data centers, Cyntec has developed a series of advanced products, including high power density chokes, power modules, busbars, and E-fuses. With a focus on innovation and quality, Cyntec enables customers to meet the stringent performance, safety, and thermal management requirements of next-generation AI infrastructure and HVDC-powered data centers.
Cyntec, a global leader in power choke and power module solutions, is driving energy efficiency and sustainability in AI and HPC data centers, switches with innovative material, power design technologies.
Cyntec has developed compact, high-efficiency, low-loss power inductors specifically designed for applications such as AI server SXM accelerator cards, UBB motherboards, and Switch. These inductors are the result of Cyntec’s proprietary technologies, which encompass everything from material formula research and product characteristic simulations to advanced automated production capabilities. By utilizing 3D modeling, optimizing coil parameters, and applying its unique patented material formulas, Cyntec has significantly enhanced the magnetic components' saturated current, thereby reducing both power loss.
The innovative TLVR power inductor, with its multi-phase, thin-profile design, has successfully improved dynamic response efficiency and power conversion efficiency, while reducing power design space and energy consumption. This solution also meets the demanding requirements of high current transient in AI server applications.
In response to the high power density demand in the AI/HPC applications, Cyntec offers multi-phase power modules by utilizing proprietary IC-packaging and advance magnetics technology. The miniaturized VRM solution boost the current density and transient response meeting the ever-increasing computing power demand in GPU/xPU/ASICs systems.
Cyntec’s Liquid-cooled busbar supports power capacity up to 50Vdc/8000A, providing an innovative cooling solution that ensures stable and reliable operation in AI data centers.
Cyntec’s innovative e-fuse module can be integrated into rack-mounted PDU/ CBU/ BBU /DC power supplies within HVDC architecture. It features protection against abnormal voltage, current, and overheating, and supports safe disconnection and soft start during hot-swapping. Compared to traditional ones, it offers response speeds over a thousand times faster and significantly enhanced safety.
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